Laminates:

 

Flexible polyimide laminates, coverlays & adhesives

 

 

High performance and microwave laminates

 

FR2, CEM-1 and FR4 

Copper clad laminates

Imaging:

 

Dry film & diazo


Artwork protection film

Photoplotters, ink jet printers, direct imager

Silver film, jettable ink and chemistry

Pressing:

Pressing tools, register pins and release agents

Drilling:

Solid tungsten carbide drills and routers

 

Lamination enhancement products and technologies

High performance entry and backup material

Copper and special foils:

Copper foils

 

Resistive foils


High performance coated foils for  HDI applications

Copper Aluminium Copper

 Materials and chemistry:

 

Printed electronics inks 
and thick film pastes

Coating measurement equipment
  

 
Consumables

PCB & GMF
surface treatment chemistry