Coating measurement

At each step of your process, Verlab brings solutions to control and increase security of your processes and products.

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CMI125/CMI125A: Identifying Copper thickness
	Identify or measure Copper foil thickness fast and accurately before starting manufacturing process Micro resistance method: Unlike other test methods, it is not affected by Copper coating on the opposing side of the printed circuit board. Only available handheld gauge that measures the entire range of Copper foil thicknesses from 5 to 140 µm Digital display with immediate reading in Oz Proven durability and simple to use Factory calibrated and requires no standards Rechargeable battery
CMI610: Measuring plated thru-hole Copper prior to and after etch
	Portable gauge capable of measuring plated thru-hole Copper prior to and after etch. Automatic temperature compensation allows for accurate measurement of plated thru-hole Copper immediately after pulling from the tank Works equally well on double-sided and multi-layer boards, even through tin and tin/lead resist High and low limits can be set to detect when out of specification Reads in µm and mils. Large LCD display and USB output for uploading to PC. Rechargeable battery
CMI615: Measuring Copper thickness
	Portable gauge Ideal for measuring surface copper thickness on rigid, flexible, single and double-sided or multilayer PCB boards. Microresistance technology for accurate measurement of surface copper thickness Reads in µm and mils. Rechargeable battery. Large LCD display and USB output for uploading to PC.
CMI805: Controlling the final product
	Desktop surface and thru-hole Copper thickness and surface copper thickness on rigid, flexible, single and double-sided or multilayer PCB boards. Reads in µm and mils. Printer output, direct print. Large LCD display and USB output for uploading to PC.

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