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Hi-Performance copper clad laminates and prepregs

Flexible polyimide laminates, coverlays & adhesives

High Reliability PI & no-flow

Microwave and thermally conductive laminates and prepregs

FR2, CEM-1, FR4 and copper

PCB & GMF surface treatment chemistry and photoresist

Silver film, jettable ink and chemistry

Lamination enhancement products and technologies

Copper Aluminium Copper Copper Steel Copper

Copper foils

Copper foils

Resistive foils

Solid tungsten carbide drills and routers

High performance entry and backup material

Pressing tools, register pins and release agents

Contamination control adhesive materials

Printed electronics inks and thick film pastes

Functional ceramic materials for Aluminium Nitride substrate

Piezoelectric electroactive polymers

Dry electrodes and adhesives

Solamet® PV metallization paste

Technical cleaning

Coating measurement equipment