Passive Component Materials

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Micromax materials enable tighter tolerance and performance of smaller chip components, as well as high precision and robustness for more complex and demanding applications such as automotive, infrastructure, etc.

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Chip Resistor

Micromax resistive materials feature:

- - - - Wide process window including firing temperture and resistor size
      - Tight resistivity and TCR control on small chip sizes
      - Excellent power handling performance
      - Electrostatic discharge
      - Anti-sulfuration conductors
      - Polymeric conductor options
      - Lead-free systems

Resistor Series

Resistor Series	Features
00x1Z/00×1	Enhanced power handling (ESD, STOL) Higher yield at laser trimming Optimized printability for small chip sizes Designed for <0.5mm sq resistor geometry with 7µm fired thickness
0FxxA/0FxxE	Lead free* resistor series Designed for <0.5mm sq resistor geometry with 6µm fired thickness

Conductors & Encapsulants for Chip Resistor

C1 Conductor	Features	Composition	Firing temperature
5421E	Lead free standard C1 Platable	Ag/Pd (0.5%)	850°C
5465	Lead free lower cost Platable	Ag/Pd	850°C
5463	Lead free low cost Platable	Ag	850°C
5424E	Lead free specialty C1 Platable	Ag/Pd (2%)	850°C
5418	Lead free specialty C1 Platable Blendable with 5421E	Ag/Pd (18%)	850°C

C2 Conductor	Features	Composition	Firing / Curing temperature
5402E	Lead free Platable Dipping	Ag	600°C
5430E	Lead free Platable Screen printing	Ag	600°C
5450T	Lead free Platable Dip & roller coat	Ag	200°C

Encapsulant	Features	Color	Firing / Curing temperature
5477	Lead free Fired G1	Green	600°C
5499	Lead free Polymer G2	Black	180°C
5499A	Lead free Polymer G2	Black	180°C
5436F	Lead free Fired G2	Black	620°C

Multilayer Capacitor

Micromax Multilayer Capacitor materials provide:

- - - - Excllent green strenght, solderability and adhesion
      - Dip cosmetics
      - Platable materials which do not require tumbling or burnishing

Polymer termination	Composition	Coating method	Curing temperature
8452	Ag	Dipping	200°C
8453	Ag	Dipping	200°C
8455	Ag	Roller Coating	200°C

Fired termination	Composition	Coating method	Firing temperature
1187	Ag Platable	Dipping	800°C
4899R	Ag Solderable	Dipping	850°C
4999	Ag/Pd Solderable	Dipping	710-750°C

Tantalum Capacitor

Micromax Tantalum Capacitor materials provide:

- - - - Low ESR
      - Uniform thin thickness at chip corners
      - Low cure temperature

Product	Composition	Coating method	Curing temperature
7775	Ag Thermoplastic	Dipping	160°C
5262L	Ag Thermoset	Dipping	200-220°C
7252	Graphite	Dipping	180°C

*Lead "free" as used herein means that lead is not an intentional ingredient in and is not intentionally added to the referenced product. Trace amount however might be present.