Metallisierung - Products - CCI Eurolam

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Making hole conductive

DuPont longstanding expertise in electroless copper plating solutions

Electrolytic copper plating

DuPont electrolytic copper plating and via filling advanced chemistry

Inner layer bonding

Dupont treatment etch are formulated to produce a uniform, highly-textured and passivated surface coating on copper innerlayers.

PCB final finishes

ENIG, ENEPIG, Tin and SnPB high performing PCB latest final finish product from DuPont Electronic Solutions.

3D-MID

Metallization chemistry for 3D Molded Interconnect Device (MID) technology

Entwickler, Stripper & Hilfsmittel

DuPont Electronic Solutions ergänzt sein Angebot an bildgebenden Produkten durch eine breite Palette von Produkten für Entwicklungs-, Ätz- und Strippprozesse.

PCB circuitry inks

Printable silver and copper inks for PCB trace and via-filling applications