3D-MID
Muster anfordernDupont metallization expertise provide a complete metalisation process for 3D-MID Technology, enabling highly integrated electronic 3D molded interconnect device (MID) technology. Through laser direct structuring, conductive traces can be produced on the surfaces of injection-molded parts. This provides a unique way of integrating mechanical and electronic functions on a molding.
Haben Sie eine Frage? Kontaktieren Sie uns![](https://www.ccieurolam.com/wp-content/uploads/dupont-logo.png)
![](https://www.ccieurolam.com/wp-content/uploads/3D-MID-270x200.jpg)
![](https://www.ccieurolam.com/wp-content/uploads/3Dmid21.png)