PCB final finishes
Muster anfordernENIG, ENEPIG, Tin and SnPb high performing PCB latest final finish product from DuPont Electronic Solutions. Designed to lower board manufacturer process costs, while maintaining optimum reliability and performance.
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Tin & Tin-Lead plating and stripping
Tinposit™ Immersion Tin is a tin deposition product, which produces uniform, smooth tin deposits on copper and copper-based alloys by an immersion reaction. Ronastan™ is an acidic tin plating solution which produces smooth, fine-grained deposits over a wide plating range. Ronastan™ deposits are designed for use as etch resists in the manufacture of PCBs, with excellent throwing power and metal distribution, even in high-aspect through holes and microvias.
| Type | Deposit | Designation | Features |
|---|---|---|---|
|
Electrolytic |
Tin plating |
RONASTAN EC |
Sulfuric base |
|
Electroless |
Tin deposit |
TINPOSIT |
|
|
Electrolytic |
SnPb (60/40) plating |
SOLDERON PC |
high stability of the alloy, very high distribution, MSA-base |
|
Tin Stripper |
ENVIROSTRIP™ 785 |
High efficency one step stripper |
|
|
Tin Stripper |
RONASTRIP TL85 |
Nitric acid free |
Nickel, Gold & Palladium deposit
Aurolectroless™ Immersion Gold and Duraposit™ Electroless Nickel from DuPont Electronic Solutions are designed to lower board manufacturer’s ENIG process costs, while maintaining optimum reliability and performance. The product delivers uniform, fine-grained deposits of pure gold on substrates including electroless Nickel and Palladium.
| Type | Deposit | Designation | Features |
|---|---|---|---|
|
Electroless |
ENIG: Nickel – Gold |
RONAMAX SMT |
|
|
Electroless |
ENIG: Nickel – Gold |
Duraposit™ SMT 88 |
Improved corrosion resistance |
|
Electroless |
Palladium |
PALLAMERSE |
|
|
Electroless |
ENEPIG: Ni – Pd – Au |
AUROLECTROLESS |
High stability, low gold concentration & EDTA-free versions |
|
Electrolytic |
Nickel-Gold |
NIKALPC3 + AURONAL BGA |