Conductors

Micromax™ offers a complete set of conductors covering a broad application spectrum.

Designed to deliver the best reliability/performance vs. system level cost, these materials enable more cost-effective manufacturing processes, including fine line printing, 30 or 60 minute firing profiles, co-fireability and unprecedented field reliability.

The conductors allow several different interconnect strategies, ranging from 25-micron gold wirebond to heavy gauge aluminum wirebond, wedge bond, ribbon bond, ball grid array (BGA), flip chips, and more.

Additional benefits include low noise characteristics (rated up to five times better than those of conventional systems), improved post-laser trim stability (improved by a factor of three), and outstanding durability at high temperatures.

Micromax™ Ag/Pt conductors offer high solder leaching resistance and good soldering performances.

Gold conductors are used for high reliability applications owing to their low resisitivity, resistance to metal migration even in harse environments and non oxidation and corrodation properties.

Micromax™ Silver Palladium conductors limit the silver migration in harsh envrionment and improve solderability.

Micromax™ copper based conductors offer a high conductivity for application where soldering and heavy Alu wires maybe be required with excellent thermal and electrical properties such as Power electronics.

Micromax™ Platinium conductors are suitable to operate at elevated temperatures and can be used as electrodes for sensors applications.