Rogers Prepregs & Bondply

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Rogers' Advanced Connectivity Solutions (ACS) business manufactures leading high frequency laminates, bondplys and prepregs, engineered to meet stringent performance requirements and exceptional dielectric constant control. ACS Materials are a consistent and reliable choice for applications including 5G wireless communication, automotive radar sensors, aerospace, satellites and more.

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Bonding Materials

Product	Material Type	Glass Type	Dk (10 GHz)	Df (10 GHz)	CTE (X/Y/Z)ppm/°C	UL94	H²O Absorp	Tc (W/ m-K)
92ML™ Prepreg			5.3 (1MHz)	0.011 (1MHz)	18/18/27	V-0	0.12	1.60
2929 Bondply			2.94 ±0.05	0.0030	50/50/50		0.1	0.40
Coolspan® TECA film	Thermally & Electrically Conductive Thermoset Adhesive		N/A	N/A	45/45/45		N/A	6.00
6250 Bonding Film			2.32	0.0013	-/-/-		0.01	0.17
6700 Bonding Film			2.35	0.0025	-/-/-		0.01	0.17
RO4460G2™	Hydrocarbon/Ceramic	Woven/Prepreg	6.15±0.15	0.0040	15/18/43	V-0	0.13	0.67
RO4450T™	Hydrocarbon/Ceramic	Woven/Prepreg	3.32 ±0.05	0.0039	20/21/57	V-0	0.11	0.50
RO4450F™	Hydrocarbon/Ceramic	Woven Prepreg	3.52 ±0.05	0.0040	19/17/50	V-0	0.09	0.65
Xtreme Speed™ RO1200™ Bondply			2.97	0.0012	15/15/35	V-0	0.13	0.5
SpeedWave™ 300P Prepreg			3.16	0.0021	15/15/35	V-0	0.12	0.48

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