Passive Component Materials

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Micromax materials enable tighter tolerance and performance of smaller chip components, as well as high precision and robustness for more complex and demanding applications such as automotive, infrastructure, etc.

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Chip Resistor

Micromax resistive materials feature:

- - - - Wide process window including firing temperture and resistor size
      - Tight resistivity and TCR control on small chip sizes
      - Excellent power handling performance
      - Electrostatic discharge
      - Anti-sulfuration conductors
      - Polymeric conductor options
      - Lead-free systems

Resistor Series

Resistor Series	Features
00x1Z/00×1	Enhanced power handling (ESD, STOL) Higher yield at laser trimming Optimized printability for small chip sizes Designed for <0.5mm sq resistor geometry with 7µm fired thickness
0FxxA/0FxxE	Lead free* resistor series Designed for <0.5mm sq resistor geometry with 6µm fired thickness

Conductors & Encapsulants for Chip Resistor

C1 Conductor	Features	Composition	Firing temperature
5421E	Lead free standard C1 Platable	Ag/Pd (0.5%)	850°C
5465	Lead free lower cost Platable	Ag/Pd	850°C
5463	Lead free low cost Platable	Ag	850°C
5424E	Lead free specialty C1 Platable	Ag/Pd (2%)	850°C
5418	Lead free specialty C1 Platable Blendable with 5421E	Ag/Pd (18%)	850°C

C2 Conductor	Features	Composition	Firing / Curing temperature
5402E	Lead free Platable Dipping	Ag	600°C
5430E	Lead free Platable Screen printing	Ag	600°C
5450T	Lead free Platable Dip & roller coat	Ag	200°C

Encapsulant	Features	Color	Firing / Curing temperature
5477	Lead free Fired G1	Green	600°C
5499	Lead free Polymer G2	Black	180°C
5499A	Lead free Polymer G2	Black	180°C
5436F	Lead free Fired G2	Black	620°C

Multilayer Capacitor

Micromax Multilayer Capacitor materials provide:

- - - - Excllent green strenght, solderability and adhesion
      - Dip cosmetics
      - Platable materials which do not require tumbling or burnishing

Polymer termination	Composition	Coating method	Curing temperature
8452	Ag	Dipping	200°C
8453	Ag	Dipping	200°C
8455	Ag	Roller Coating	200°C

Fired termination	Composition	Coating method	Firing temperature
1187	Ag Platable	Dipping	800°C
4899R	Ag Solderable	Dipping	850°C
4999	Ag/Pd Solderable	Dipping	710-750°C

Tantalum Capacitor

Micromax Tantalum Capacitor materials provide:

- - - - Low ESR
      - Uniform thin thickness at chip corners
      - Low cure temperature

Product	Composition	Coating method	Curing temperature
7775	Ag Thermoplastic	Dipping	160°C
5262L	Ag Thermoset	Dipping	200-220°C
7252	Graphite	Dipping	180°C

*Lead "free" as used herein means that lead is not an intentional ingredient in and is not intentionally added to the referenced product. Trace amount however might be present.

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Passive Component Materials

Chip Resistor

Resistor Series

Conductors & Encapsulants for Chip Resistor

Multilayer Capacitor

Tantalum Capacitor

*Lead "free" as used herein means that lead is not an intentional ingredient in and is not intentionally added to the referenced product. Trace amount however might be present.

Chip Resistor

Resistor Series

Conductors & Encapsulants for Chip Resistor

Multilayer Capacitor

Tantalum Capacitor

*Lead "free" as used herein means that lead is not an intentional ingredient in and is not intentionally added to the referenced product. Trace amount however might be present.

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