PACOTHANE TECHNOLOGIES-PACOTHAPACOPADS™-PRESSURE EQUALIZATION PRESS PADS FOR LAMINATION OF FLEXIBLE AND MULTILAYER CIRCUIT BOARDS
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Circuit imprimé,
Pressage
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PACOTHANE TECHNOLOGIES-PACOTHANE® PLUS- FOR LAMINATION OF RIGID-FLEX CIRCUITS
Datasheets
Circuit imprimé,
Pressage
PACOTHANE TECHNOLOGIES-PACOTHANE® HT1500-FOR LAMINATION OF RIGID MULTILAYER, FLEXIBLE CIRCUITS AND UNCLAD LAMINATES
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Circuit imprimé,
Pressage
PACOTHANE TECHNOLOGIES-PACOLON™-FOR LAMINATION OF MULTILAYER AND FLEXIBLE CIRCUITS
Datasheets
Circuit imprimé,
Pressage
PACOTHANE TECHNOLOGIES-PACOFLEX™ 10000- For lamination of coverlays and flexible circuits
Datasheets
Circuit imprimé,
Pressage
PACOTHANE TECHNOLOGIES-PACO•VIA™ 3200- BLIND VIA HOLE LAMINATING FILM
Datasheets
Circuit imprimé,
Pressage
PACOTHANE TECHNOLOGIES-PACO•CLUTCH™-SINGLE COMPONENT, CONFORMABLE « CLUTCH » FILM PACKAGE FOR PCB « CAP » LAMINATIONS
Datasheets
Circuit imprimé,
Pressage
PACOTHANE TECHNOLOGIES- Paco-Clutch™ A SINGLE COMPONENT, CONFORMABLE « CLUTCH » FILM PACKAGE FOR PCB « CAP » LAMINATIONS
Datasheets
Circuit imprimé,
Pressage
Pacoflex Ultra
Datasheets
Circuit imprimé,
Substrats
NIKKAN INDUSTRIES CO-NIKAFLEX® SAFV
Datasheets
Circuit imprimé,
Substrats
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