Release Films

High Performance Release Film
Provides quick and easy release between multilayers
Protects copper from pits and dents caused by defective plates and air-born contaminants
Low shrinkage

High Temperature Release Film provides excellent, contamination-free release during the process of laminating rigid Polyimide PCBs, all flexible circuit boards, Teflon and other demanding applications

Ultra-High Temperature Easy Release Film offers the consistent attainment of proper release, surface protection and conformability under the harsh conditions and challenges of elevated temperature laminations. Extremely low X&Y Axis shrinkage.

THERMOFILM™ is a two-sided Release Film engineered for Ultra High Temperature PCB laminations requiring an easy clean release after elevated temperature lamination cycles. Designed to eliminate using inexpertly designed lamination layups, THERMOFILM™, when used with THERMOPADS™ provides the « PACOTHANE® » standard of specific application based attributes. THERMOFILM™ offers the consistent attainment of proper release, surface protection and conformability under the harsh conditions and challenges of elevated temperature laminations.

THERMOFILM™ High Temperature Release Film is offered in one thickness of 1.5 mils. (38µm). All PACOTHANE® Release Films are manufactured in accordance to our quality standards which guarantees unparalleled performance. All manufacturing and fabrication operations are performed in house offering total supplier control and accountability.

PACO•VIA™ 3500 is a two-sided release film designed to be part of a Two-Component System (PACO•VIA™ 3500 and PACOPADS™) as a performance-driven line of High-Temperature, Resin-Blocking Release Films. The PACO•VIA™ System is specifically engineered to enhance sequential lamination of Buried and Blind Via designed rigid printed Circuit Boards. PACO•VIA™ 3500 allows the user to select an alternative release film that may be better suited for less robust post lamination cleaning processes.

• Resin Containment: contains the resin within the via barrel eliminating the need for secondary processing to remove cured resin from the panel surface
• Barrel Fill: allows the liquid resin to essentially fill the via Barrel
• Contain Resin Squeeze-out: contains resin squeeze-out like traditional release films while offering superior copper surface buffering from damaged Separator Plates
• Equalization of Pressure throughout the Pressure Load: The PACOPADS™ component of the PACO•VIA™ System ensures complete barrel fill, and controlled Dielectric Thickness. PACOPADS™ eliminate air voids, inner-layer slippage and white corners or edges. PACOPADS™ also reduce image and glass cloth Transfer, and alleviate the potential of low-pressure prepreg Blisters.

PACO•CLUTCH™ is a two-side releasable film, engineered specifically for use by PCB Multilayer manufacturers that laminate etched copper laminate cores, in place of copper foil. In the outer layer lamination process, this state-of-the-art product performs a dual purpose in the production of Cap Layer constructions:

First, PACO•CLUTCH™ decouples the outer-layer etched core from the separator plate during PCB lamination at temperatures up to 425°F (218°C) for up to 2 hours
Simultaneously, PACO•CLUTCH™ doubles to effectively achieve the required « Clutch Effect » that is attributable to the degree of conformability designed into this .011″ (279µ) thick product.