Electrolytic copper plating
Demander un échantillonDuPont’s longstanding expertise in copper plating is an excellent match for the demands of high density pcb including rigid-flex . DuPont is committed to providing solutions that will enable high performance in any design configuration. Our highly conductive copper metallization is compatible with roll-to-roll processing and low-stress for long-term durability.
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Copper plating & via filling
| Current | Designation | Features |
|---|---|---|
|
Pulse |
COPPER GLEAM PPR |
High productivity |
|
Pulse |
COPPER GLEAM CUPULSE |
High aspect ratio (~15) |
|
Direct |
COPPER GLEAM PC |
Simplicity of analysis and control (mono additive) |
|
Direct |
COPPER GLEAM CLX |
Excellent properties with large process window |
|
Direct |
ELECTROPOSIT 1300 |
Designed for compatibility with direct plate. Easy control with Hull cell. |
|
Direct |
COPPER GLEAM HT55 |
Excellent distribution and elongation |
|
Direct |
COPPER GLEAM HGX |
Very high ductility, flex circuits, soft materials |
|
Direct |
MICROFILL EVF |
Small holes and blind vias |
|
Direct |
MICROFILL THF |
designed to provide through hole fill |