Rogers Prepregs & Bondply

Demander un échantillon

Rogers' Advanced Connectivity Solutions (ACS) business manufactures leading high frequency laminates, bondplys and prepregs, engineered to meet stringent performance requirements and exceptional dielectric constant control. ACS Materials are a consistent and reliable choice for applications including 5G wireless communication, automotive radar sensors, aerospace, satellites and more.

Avez-vous une question? Contactez-nous

Bonding Materials

Product	Material Type	Glass Type	Dk (10 GHz)	Df (10 GHz)	CTE (X/Y/Z)ppm/°C	UL94	H²O Absorp	Tc (W/ m-K)
92ML™ Prepreg			5.3 (1MHz)	0.011 (1MHz)	18/18/27	V-0	0.12	1.60
2929 Bondply			2.94 ±0.05	0.0030	50/50/50		0.1	0.40
Coolspan® TECA film	Thermally & Electrically Conductive Thermoset Adhesive		N/A	N/A	45/45/45		N/A	6.00
6250 Bonding Film			2.32	0.0013	-/-/-		0.01	0.17
6700 Bonding Film			2.35	0.0025	-/-/-		0.01	0.17
RO4460G2™	Hydrocarbon/Ceramic	Woven/Prepreg	6.15±0.15	0.0040	15/18/43	V-0	0.13	0.67
RO4450T™	Hydrocarbon/Ceramic	Woven/Prepreg	3.32 ±0.05	0.0039	20/21/57	V-0	0.11	0.50
RO4450F™	Hydrocarbon/Ceramic	Woven Prepreg	3.52 ±0.05	0.0040	19/17/50	V-0	0.09	0.65
Xtreme Speed™ RO1200™ Bondply			2.97	0.0012	15/15/35	V-0	0.13	0.5
SpeedWave™ 300P Prepreg			3.16	0.0021	15/15/35	V-0	0.12	0.48

Menu

Arlon Hi-Rel PI et sans fluage

Rogers Prepregs & Bondply

Bonding Materials

Bonding Materials

Document title